Description
Broadcom OSD is hiring an IC Substrate and Package/Interposer Layout Engineer to design and layout advanced substrates and IC packages, develop script-based layout tools, perform DRC and LVS checks, collaborate with design and verification teams, and evaluate fabricated parts. The role requires extensive experience with Cadence and EDA tools, multilayer high-speed RF design, package and substrate manufacturing, and surface mount technology. The annual base salary is $141,300 to $226,000, with discretionary bonus, equity, and medical, dental, and vision benefits.
