Substrate Packaging Research and Development Engineer at Intel

Compensation · Listed in posting

$133,800 – $188,890/yr

Setup: Hybrid
Location: Phoenix, Arizona
Type: Full-time
Level: senior
Posted: Sep 28, 2026

Description

Intel is hiring a Packaging Module Development Engineer to develop and optimize advanced semiconductor packaging processes, materials, and equipment for high-volume manufacturing. The role involves designing process specifications and workflows, conducting design of experiments, improving process capability and productivity, collaborating with cross-functional teams, establishing material specifications, and supporting equipment and process health. The position is based in Phoenix, Arizona, with a hybrid work model, and offers an annual salary range of $133,800 to $188,890 USD.

Required Skills

Design of experiments
Statistical analysis
Statistical process control
Material characterization
Laser micro-machining

Additional Information

Minimum Education: PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a similar engineering discipline
Required Previous Experiences: At least 1 year of related experience
Experience combining engineering judgment and data analysis to draw conclusions, build models, and design experiments
Experience in materials science and engineering and material characterization techniques
Experience with design of experiments, statistical data analysis, and statistical process control
Preferred Qualifications: Working knowledge or prior experience in optics and lasers, laser micro-machining, and micro-fabrication
Translation Company Name: 100 Intel Corporation