Description
Intel is seeking an experienced individual to join their Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization. The role involves leading substrate supplier development and qualification activities for advanced packaging technologies like high-density FCBGA, EMIB-T, and glass-core substrates. Responsibilities include collaborating with suppliers and internal engineering teams to develop robust building-block processes, advancing substrate building-block technologies, ensuring PCS commitment adherence, designing factory technology validation plans, developing micro-schedules, and leading qualification activities.
