Description
Intel is hiring an Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly Engineer to lead substrate supplier development and qualification for advanced packaging technologies, including high-density FCBGA, EMIB-T, and glass-core substrates. The role manages supplier readiness, process validation, product certification, factory startup schedules, yield improvement, and production ramp indicators while collaborating with internal engineering teams and global supplier partners. It requires an on-site presence in Phoenix, Arizona, with periodic meetings in East Asia and occasional supplier-site trips, and offers an annual salary range of $120,860 to $198,820 USD.
