Description
Apple is hiring a hardware packaging engineer to own and drive package-substrate selection, architecture optimization, manufacturing, reliability, and roadmap development for electronic packaging solutions. The role leads RFSIP package-substrate development, collaborates with substrate manufacturers, foundries, and OSATs, defines new materials and specifications, and solves technical issues across the product development cycle. The position requires a bachelor's degree and at least 10 years of relevant industry experience, with 5% international travel.
