Description
NXP is hiring a System IC Architect to define and lead advanced power management and System-in-Package solutions for Point-of-Load applications, including automotive 48V systems and AI compute platforms. The role owns product concepts and specifications, develops technology roadmaps, integrates ICs and power semiconductors, supports thermal and electrical analysis, and advises on power management technologies and reliability. It requires extensive experience in power semiconductors, packaging, and system-level integration, with a master’s degree preferred and a Ph.D. preferred.
