Description
TechInsights is hiring a Technical Fellow focused on Advanced Packaging Integration to serve as a subject-matter expert across advanced packaging, HPC processors, networking ASICs, and memory integration. The role owns technology roadmaps, identifies high-value analysis opportunities, applies AI-enabled workflows, and represents the company globally through conferences, customer discussions, and thought leadership. Candidates need 10+ years of relevant semiconductor experience, a master’s or PhD in a relevant field, and expertise in packaging, interconnects, processor architecture, and system-level performance. The position is on-site in Ottawa with up to 25% international travel and an expected salary of $175,000–$195,000 CAD.
