Technical Lead Package Platform Engineer at Astera Labs

Department: Packaging

Compensation

$160,000 – $200,000/yr

Location: San Jose, California
Type: Full-time
Level: not_specified
Posted: Aug 22, 2026

Description

Astera Labs is seeking a Lead Package Engineer to oversee the development, qualification, and manufacturing of advanced FCBGA packages. The role involves driving package development from concept through NPI, ensuring technical execution, managing supplier relationships, and addressing customer quality issues. The engineer will collaborate with various internal and external teams to deliver robust, manufacturable, and reliable package solutions.

Required Skills

Electronic Packaging
FCBGA Assembly Manufacturing Processes
Laminate Substrate Technologies
NPI Development
Package Implementation
Technical Project Management Skills
Root Cause Analysis
Failure Analysis

Additional Information

Required Previous Experiences: Minimum of 5 years of professional experience in electronic packaging fields.
Strong experience in FCBGA assembly manufacturing processes and laminate substrate technologies.
Proven NPI development experience for advanced flip-chip packages, from early package definition through qualification and production release.
Experience with package implementation from die netlist to flip-chip package design and manufacturing.
Demonstrated experience managing substrate suppliers and assembly OSAT partners.
Strong technical project management skills, including schedule and milestone management, technical risk assessment, issue resolution, and cross-functional execution.
Demonstrated ability to lead and collaborate across Product Engineering, Program Management, Quality, Marketing, Design, and external supplier teams.
Experience managing and resolving customer returns and field quality issues related to semiconductor packaging, particularly package assembly processes, material quality, and supplier workmanship.
Strong problem-solving skills with experience in root cause analysis, failure analysis, containment, corrective actions, and recurrence prevention.
Preferred Qualifications: Subject-matter expertise in Co-Packaged Optics (CPO) and/or Near-Packaged Optics (NPO).
Deep technical expertise in package and substrate warpage, including characterization, modeling, material interactions, and assembly process impacts.
Translation Company Name: Astera Labs

About Astera Labs

Astera Labs

Silicon-based hardware connectivity solutions and software for rack-scale AI.San Jose, CA, United States

Astera Labs builds silicon-based hardware connectivity solutions and software for rack-scale AI, including smart fabric switches, retimers, memory controllers, and signal conditioners. Astera Labs reported second-quarter 2026 revenue of $392.4 million, up 27% quarter over quarter and 104% year over year.

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