Description
Applied Materials is hiring a full-time Advanced Packaging Process Integration Intern in Singapore. The intern will support the Process Integration team by developing and characterizing test vehicles for chip-to-wafer and wafer-to-wafer hybrid bonding applications, including process flow development, experimental design, data analysis, defect characterization, and correlation of process parameters with electrical and physical performance. The role provides hands-on exposure to semiconductor fabrication, advanced packaging integration, statistical data analysis, and engineering problem-solving, with the expectation that the intern will develop expertise in advanced packaging technology and process integration.
