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Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating) at SAP

Location
Malaysia
Type
Full-time
Level
mid
Posted

Summary from listing

AT&S is hiring a Technology Development Engineer specializing in Solder Resistance Surface Finishing (SRSF) for its Technology Development Team in Kulim Hi-Tech Park, Kedah, Malaysia. The role covers SRSF process development, material qualification, customer communication, project and program management, technical team guidance, quality systems, and new product introduction. Candidates need a bachelor's degree in engineering or a related field, at least two years of PCB/ICS/assembly experience or seven years in the semiconductor industry, subject-matter expertise in PCB or substrate manufacturing, and strong analytical, communication, project-management, and leadership skills.

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