Description
Applied Materials is hiring a full-time Process Engineer in Singapore to lead the development and integration of advanced packaging technologies, with a focus on Hybrid Bonding for logic, memory, and 3D heterogeneous integration. The role covers process development, characterization, DOE studies, root-cause analysis, customer and ecosystem collaboration, technical documentation, and qualification of bonding technologies. Candidates need a bachelor's, master's, or PhD in engineering, materials science, physics, or a related discipline, plus at least five years of semiconductor experience in technology development, process integration, or advanced packaging.
