Description
Intel is hiring a Thin Films Metals Module Development Engineer for its Technology Development organization to develop, define, optimize, and validate thin-film metal deposition processes for high-k/metal gate, contact, and interconnect applications. The role covers ALD, CVD, PVD, electrochemical deposition, process screening, equipment qualification, materials characterization, device validation, and cross-functional technology development. It requires a STEM PhD and at least one year of thin-film deposition experience, is based in Hillsboro, Oregon, and requires on-site availability for manufacturing operations.
