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VIE - TAIWAN- Ingénieur Packaging Backend H/F at STMicroelectronics

Department: New Technology/Product Industz

Setup
On-site
Level
not_specified
Posted

Description

This OSAT engineering role collaborates with Taiwan-based OSAT companies, learns WLCSP and STMicroelectronics NPI procedures, and works with Backend R&D teams to evaluate TGA and FMEA for new products while tracking OSAT test progress. The position requires a bachelor’s or master’s degree in chemistry, physics, or engineering, strong English skills, collaboration, and initiative.

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