Summary from listing
Amkor Technology is hiring a VP, Advanced Packaging Technology Lead to lead the strategy, development, and commercialization of advanced IC packaging solutions for computing, networking, PC, mobile, and AI markets. Reporting to the Chiplets/FCBGA Business Unit, the role coordinates customers, engineering, operations, manufacturing, sales, and R&D; owns product strategy through qualification and production ramp; and manages technology roadmaps, customer engagement, risk, and resource alignment. The position requires a bachelor's degree in engineering, 15+ years of semiconductor packaging development experience, and a master's degree is preferred. The role begins with a global assignment in Songdo, Korea, followed by an interim assignment in Tempe, Arizona, and ultimately is based in Peoria, Arizona.
