Description
Intel is hiring a Module Development Engineer for its Wafer Assembly Technology Development group in Hillsboro, Oregon. The role leads the design, development, optimization, and implementation of semiconductor manufacturing processes and equipment, including feasibility studies, process integration, pathfinding, technology roadmaps, equipment modifications, supplier collaboration, and statistical process optimization. Candidates need a relevant STEM degree and 4–9+ years of experience depending on education level, with semiconductor processing, wafer-level assembly, process development, and equipment troubleshooting experience preferred. The position is on-site and offers an annual salary range of $155,520 to $298,440 USD.
