Description
This project involves setting up a robust methodology for characterizing and analyzing scrub marks generated during the Electrical Wafer Sort (EWS) step in semiconductor manufacturing. The goal is to understand the impact of various parameters like probe card technologies, front-end technologies, and probing parameters on scrub mark characteristics, aiming to improve reliability, re-testability, and yield. This is a 1-year work-study placement for a 3rd-year Bachelor's student specializing in Physical Measurement or Instrumentation.
