10+ years of hands-on R&D experience in 300mm wafer processes, equipment, materials, or integration, with a strong preference for advanced packaging experience.
5+ years of experience leading external collaborations, customer engagements, ecosystem programs, or driving SOW/POC/DOE execution.
Preferred Qualifications
Experience partnering with advanced packaging consortia, innovation hubs, or key semiconductor industry clusters in China.
Proven ability to navigate ambiguity, influence across matrixed global organizations, and translate complex technical topics into strategic business recommendations.
Entrepreneurial mindset, high self-drive, and exceptional capability to align resources to deliver business results.
In-depth collaboration experience with advanced packaging industry alliances, innovation platforms, or major semiconductor industry clusters in China.
Strong pressure tolerance and adaptability; able to work efficiently in highly uncertain environments. Also able to exert cross-matrix organizational influence, translating complex technical issues into executable business strategies.
Entrepreneurial mindset and strong self-motivation; skilled at integrating resources from multiple parties and driving projects through to successful closure with a results-oriented approach.