先进封装技术开发封装区域轮班工程师 at Micron Technology

部门：HIG

语言

工作方式: 现场办公
地点: 台湾台中
职位类型: 全日制
级别: not_specified
发表: 2026年9月29日

说明

Micron Technology 正在台湾招聘一名 DLT 轮班工程师，以支持先进封装领域的 Die Level Technology 开发活动。该职位负责执行开发批次、响应工艺和设备异常、支持问题遏制与升级处理、维护轮班交接，并与跨职能团队合作开展 HBM 技术开发。职责包括工艺设置、资格认证准备、SPC、冗余工具部署、设备和材料评估、数据分析，以及安全与合规活动。该职位要求轮换白班和夜班，包括周末和节假日，并提供白班、夜班或固定夜班安排，采用 4-3 班表。

所需技能

半导体制造
工艺故障排查
Microsoft Excel
SPC
冗余工具
结构化问题解决
数据分析

附加信息

Minimum Education: Bachelor's degree or higher in Engineering, Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Science, or a related technical field, or equivalent relevant semiconductor manufacturing or operations experience.
Required Previous Experiences: Basic knowledge of semiconductor manufacturing processes, equipment, or engineering operations.
Ability to extract, organize, analyze, document, and communicate data using standard formats.
Effective communication, collaboration, and shift-handoff skills across multiple teams and functions.
Ability and willingness to work a rotating shift schedule, including day and night shifts, weekends, and holidays, as business needs require.
Preferred Qualifications: Experience in DLT process engineering, advanced packaging, semiconductor manufacturing, technology development, or shift-based engineering operations.
Familiarity with SPC, abnormal lot handling, process or tool qualification, redundancy tool deployment, or HBM-related development execution.
Experience working in a cross-functional development or manufacturing environment.
Translation Company Name: Micron Technology