基板 IC 封装布局设计工程师 at Etched

部门：Architecture

语言

工作方式: 现场办公
地点: 台湾台北
职位类型: 全日制
级别: senior
发表: 2026年9月17日

说明

Etched 正在招聘一名基板 IC 封装布局设计工程师，负责为高功率 AI 处理器和加速器设计复杂、大规模的 IC 基板封装。该职位涵盖多层基板布局、电源传输网络、50GHz 以上的高速信号布线、CoWoS 中介层优化、DRC 和 LVS 验证、设计文档编制，以及与硅片、信号完整性、电源完整性、封装和制造团队的跨职能协作。该职位要求拥有相关工程领域的学士或硕士学位，并具备至少 10 年 IC 基板布局经验；工作地点为圣何塞或台北。

所需技能

IC 基板布局
电源传输
高速信号
CoWoS 中介层
Allegro Package Designer
信号完整性
电源完整性
DRC
LVS

附加信息

Minimum Education: Bachelor’s or master’s degree in Electrical Engineering, Computer Engineering, or a related field
Required Previous Experiences: 10+ years of IC substrate layout design experience for high-performance processors or accelerators
Experience with large substrate packages greater than 50mm and complex high-density layouts
Experience with high-power package designs and robust power delivery networks
Experience with high-speed signaling design above 50GHz and signal integrity challenges
Experience with CoWoS interposer design and its impact on substrate design
Translation Company Name: Etched

关于 Etched

Etched

AI hardware11-50

Etched is building a new category of AI hardware: frontier inference clusters, co-designing chips, racks, software, and manufacturing methods for frontier models. Etched says it has co-designed with leading AI companies, cloud providers, and hyperscalers, and tested racks in representative data center deployments. The company says its first racks ship this summer and production has started to fulfill over $1B in customer contracts.

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